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H3C S7500X Ghigh End Multiservice network Routing Switch High Speed 40G and 100G

H3C S7500X Ghigh End Multiservice network Routing Switch High Speed 40G and 100G

Brand Name: H3C
Model Number: H3C S7500X-G Series
MOQ: 1
Price: According to the configuration requirements
Payment Terms: L/C,T/T,Western Union,D/A,D/P
Supply Ability: 500
Detail Information
Place of Origin:
China
Certification:
Tolly
Communication Mode:
Full-Duplex & Half-Duplex
Switching Capacity:
4.75Tbps-22.40Tbps
Forwarding Capacity:
2120Mpps-10000Mpps
PSU Slots:
2
Operating Environment:
Temperature: 0°C To 45°C (32°F To 113°F) Humidity: 5% To 95% (non-condensing)
Input Voltage:
Voltage DC: –48V To –60V AC: 100V To 240V
Warranty:
3 Years
Products Status:
In Stock
Packaging Details:
Original packaging
Supply Ability:
500
Highlight:

H3C S7500X-G Routing Switch

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H3C Multiservice Routing Switch

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network Routing Switch High Speed

Product Description

High performance

Distributed Architecture: to achieve wire-speed non-blocking forwarding of IPv4/IPv6 traffics, with slot bandwidth up to 960Gbps* (bidirectional) on S7503X-G and S7510X-G/S7510X-G-PoE, 640Gbps* (bidirectional) on S7506X-G/S7506X-G-PoE/S7506X-G-MF.

High Speed 40G and 100G cards: to elevate uplink bandwidth, and help build a high bandwidth Campus.

Ultra-low forwarding latency: can be as less as <1µs to ensure a fluent use experience.

*: Based on LSCM3MPUS10C0/LSCM3MPUS06A0. ‘Bidirectional’ means sending + receiving, for instance, 960Gbps=480G sending direction + 480G receiving direction.

Multi-service integration

High level and multi-service Integration: integration of LAN & WLAN (Embedded AC), integration of security service (FW card), integration of PON (XGSPON, GPON OLT card), to combine diverse service into one Chassis.

Integration of Wireless network: with the feature of Embedded wireless AC: to delivers rich wireless functionalities, including refined user control and management, complete RF management and security control, fast roaming, outstanding QoS capability, providing customers with more options for building wired and wireless integrated networks.

AON (Adaptive Optical Network): S7500X-G can integrate Ethernet line cards, AON PoE++ card along with OLT cards in one single chassis, carrying Optic-Electric Hybrid Network, Multichannel Optical Network, and Passive Optical Network in one single chassis at the same time to build a ‘Fiber optical to the room’ network, guaranteeing continuous bandwidth upgrades, delivering the benefits brought by H3C AON solution, such as long distance PoE, simplified network architecture, centralized management, etc.

Strong aggregation ability

Abundant and flexible combination of line Cards: 1G card, 1G PoE+ card, 1G+10G hybrid card, 10G Card,10G+25G hybrid card, to aggregate all types of networks.

AON PoE++ card (32*10G + 16*25G): with H3C AON (Adaptive Optical Network) solution to provide long distance (1KM) and high bandwidth PoE solution.

Security assurance

MACsec (256bits) capability: MACsec, an industry-standard point-to-point link-layer security technology, is supported across all ports of the SF series cards, protecting the network from security threats on the deepest data level.

NAC gateway: supports a variety of access authentication methods, and can be used as an authentication gateway for tens of thousands of users in the Campus. S7500X-G can play a key role in BYOD scenario, make the campus network user experience much more fluent.

Control plane—The embedded protocol packet attack recognition module prevents attacks from Topology Change Notification (TCN), Address Resolution Protocol (ARP), and other protocol packets. Use of the MD5 algorithm for the OSPF/BGP/IS-IS routing protocols prevents network breakdown caused by illegitimate route update packets.

Management plane—Use of SNMPv3, SSHv2, 802.1X and AAA/RADIUS user authentication, role-based user permission management ensures device access and management security.

Forwarding plane—Enhanced ACL capability, Standard and extended ACLs, VLAN-based ACLs and uRPF to prevent targeted traffics from accessing the network in a packet-by-packet match manner. And S7500X-G also supports the advanced Microsegmentation technology, which decouples the access policy from IP subnet, makes the policy more flexible, and accurate.

Carrier-grade reliability

3ms Hardware BFD: to ensure the network continuity.

M-LAG (Multichassis link aggregation, formerly DRNI): provides device-level redundancy and load-balance through the simplest link aggregation protocol.

IRF2 (Intelligent Resilient Framework): device level reliability technology, virtualizes multiple switches into one virtual IRF system to provide Data Center-class availability, scalability and also simplifies the management complexity. IRF2 system can be formed over a distance of 80 km (49.71 miles).

Supports a variety of high-availability features such as NSR, ISSU, Graceful Restart, Smartlink, etc.

ERPS, RRPP with millisecond-level failover performance, help customer build a resilient Ethernet Ring network, improves the performance and efficiency.

Redundancy in key components, such as MPUs, Fan tray, PSUs.

Adopting Passive backplane hardware design to eliminate single point of failures.

key components including MPU, Line cards, Fan tray, Power supply module are hot swappable.

H3C S7500X-G series can operate at high level of stability, with a carrier-grade reliability of 99.999%.

NMS and Intelligent O&M

Embedded NMS Platform (SmartMC) to provide a light-weight, convenient network management solution.

Compatible with H3C Intelligent SDN (software-defined network) campus network solution (AD-Campus) to build a SDN campus network with high-level automation, intelligence.

Support Cloud-based management through H3C Cloudnet, which is based on H3C unified O&M cloud platform, It provides a light-weight and multi-service public cloud platform for small business. It provides management of networks, terminals, users and service enabling features.

Supports Visualization technologies, INT, gRPC, Netstream, Telemetry Stream, etc.

IPv6 ready

Complete IPv4/IPv6 dual stack solutions: supports multiple IPv6 transition tunneling technologies, IPv4/IPv6 multicast technologies.

H3C S7500X-G has obtained IPv6 ready logo (phase 2), a globally recognized validation for commercial IPv6 deployment.

Cost-effective design

Differentiated and compact design: S7503X-M-G chassis hosts 124 ports in 4U chassis; Service ports integrated S7506X-G MPU provides 4*25G+6*100G service ports.

MDC (Multitenant Device Context): separates one chassis switch into several virtual switches to lower the cost through this advanced virtualization technology.

Hardware specifications

Item

S7503X-M-G

S7503X-G

S7506X-G

S7506X-G-PoE

S7506X-G-MF

S7510X-G

S7510X-G-PoE

Switching Capacity

4.75Tbps1

6.72Tbps1

13.44Tbps2

22.40Tbps2

Forwarding Capacity

2120Mpps

3000Mpps

6000Mpps

10000Mpps

MPU Slots

1~23

2

2

2

LPU Slots

1~23

3

6

10

Fan tray

14

15

1/36,7

18

PSU Slots

2

2

2

2

MPU

LSCM2CGP24TSSC0

LSCM2CGT24TSSC0

LSCM2CTGS12GPSC0

LSCM2CTGS12GTSC0

LSCM2SUP03B0

LSCM3SUP03A0

LSCM2MPUS06AS0

LSCM3MPUS06A0

LSCM2SRP6C4Y06A0

LSCM3SRP6C4Y06A0

LSCM3MPUS10B0

LSCM3MPUS10C0

MPU Processor

2 cores/1.2GHz

LSCM2SUP03B0:

4 cores/1.2GHz

LSCM3SUP03A0:

4 cores/2.2GHz

LSCM2MPUS06AS0:

2 cores/1.2 GHz

LSCM3MPUS06A0:

4 cores/2.2GHz

LSCM2SRP6C4Y06A0:

4 cores/1.8GHz

LSCM3SRP6C4Y06A0:

4 cores/2.2GHz

LSCM3MPUS10B0:

4 cores/2.2GHz

LSCM3MPUS10C0:

4 cores/2.2GHz

MPU Flash/SDRAM

4GB/2GB

LSCM2SUP03B0:

4GB/4GB

LSCM3SUP03A0:

2GB/4GB

LSCM2MPUS06AS0:

4GB/2GB

LSCM3MPUS06A0:

2GB/4GB

LSCM2SRP6C4Y06A0:

8GB/8GB

LSCM3SRP6C4Y06A0:

2GB/8GB

LSCM3MPUS10B0:

2GB/4GB

LSCM3MPUS10C0:

2GB/4GB

MPU Console Ports

1x RJ-45

1x mini USB console

1x RJ-45

1x mini USB console

1x RJ-45

1x mini USB console

1x RJ-45

1x mini USB console

MPU MGMT Ports

1x 10/100/1000M RJ45

1x 10/100/1000M RJ45

1x 1000M SFP

1x 10/100/1000M RJ45

1x 1000M SFP

1x 10/100/1000M RJ45

1x 1000M SFP

Operating Environment

Temperature: 0°C to 45°C (32°F to 113°F)

Humidity: 5% to 95% (non-condensing)

Input

Voltage

DC: –48V to –60V

AC: 100V to 240V

Dimension

(H x W x D)

175mm×436mm×420mm (6.89 × 17.17 × 16.54 in); (4U)

216mm×436mm×420mm (8.50 × 17.17 × 16.54 in); (5U)

575mm×436mm×420mm (22.64 × 17.17 × 16.54 in); (13U)

708mm×436mm×420mm (27.87 × 17.17 × 16.54 in); (16U)

Fully Loaded Weight (kg)

<28KG

<61.73LB

<35KG

<77.16LB

S7506X-G/MF:

<75KG/<165.34LB

S7506X-G-PoE:

<80KG/<176.37LB

S7510X-G:

<95KG/<209.44LB

S7510X-G-PoE:

<100KG/<220.46LB

Availability

99.999%

99.999%

99.999%

99.999%

MTBF (yrs)

61.8

59.1

38.2

111.6

MTTR (hrs)

1

1

1

1