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H3C UniServer R4900 G6 Server Latest Generation H3C X86 2U 2 Socket Rack Server

H3C UniServer R4900 G6 Server Latest Generation H3C X86 2U 2 Socket Rack Server

브랜드 이름: H3C
모델 번호: H3C R4900 G6 서버
MOQ: 1
가격: According to the configuration requirements
지불 조건: L/C,T/T,웨스턴 유니온,D/A,D/P
공급 능력: 500
상세 정보
원래 장소:
중국
원본 장소:
중국
Brand name:
H3C
모델 번호:
R4900 G6
프로세서:
인텔
메모리:
32개의 DDR5 RDIMM 슬롯, 5600MT/s 데이터 속도, 2 CPU 구성에서 8TB* CXL1*을 통한 추가 확장 메모리 슬롯 16개
CPU:
2×4세대 Intel®Xeon®Sapphire Rapids / 5세대 Intel®Xeon®Emerald Rapids SP 시리즈 각 프로세서당 64코어 및 385W 전력 소비 HB
보증:
1년
제품상태:
순서
포장 세부 사항:
오리지널 포장
공급 능력:
500
강조하다:

H3C UniServer R4900 G6 Server

,

H3C X86 2U Rack Server

,

H3C 2 Socket G6 Server

제품 설명
Product features

H3C UniServer R4900 G6 server is the latest generation H3C X86 2U 2-Socket Rack Server.

R4900 G6 is featured by Intel's new-generation Eagle Stream platform.

R4900 G6 is suitable for most general computing scenarios, including cloud computing,virtualization, distributed storage, and enterprise resource planning.

For typical applications, such as the Internet, Carriers, enterprises, and governments, R4900 G6 can provide balanced computing performance, storage capacity, power saving, scalability, and reliability. For the management part, it becomes much easier for management and deployment.

H3C UniServer R4900 G6 incorporates the latest Inte®Xeon®Scalable family processor and uses 8 - channel 5600MT/s DDR5 memory technology, bringing up to 8TB* memory expansion and a 50% bandwidth increase. The new I/O structure is compatible with PCIe 5.0 standard with a 100% increased data bandwidth compared with the previous generation.

It achieves excellent scalability through local storage support of up to 10 standard PCIe slots and up to 29 drive slots. 96% power supply energy efficiency, and an operating temperature design of 5°C-45°C, provide users with higher energy efficiency returns.

Specification

CPU

2*4th Generation Intel®Xeon®Sapphire Rapids / 5th Generation Intel®Xeon®Emerald Rapids SP series

64 Cores for each Processor and 385W power consumption

HBM technology

Chipset

Inte®C741

Memory

32 DDR5 RDIMM Slots, 5600 MT/s Data Rate, 8TB* on 2 CPU Configuration

Additional 16 Expansion Memory Slots via CXL1*

RAID controller

Dedicated PCIe HBA Controller or Raid Controller

Standard PCIe HBA Controller or Raid Controller

FBWC

8 GB Cache, support Supercapacitor Protection

Storage

29 SAS/SATA Drives

Front 12 LFF bays, Rear 4 LFF bays

Front 25 SFF bays, Rear 4 SFF bays

24 U.2 NVMe Drives

SATA/NVMe M.2 Kit, DSD Model (2*SD card kit)

Network

1 Onboard 1Gbps Management Network Port

2 Onboard OCP 3.0 Slots for 4 GE or 2 10GE or 2 25GE or 2 100GE NICs

PCIe Standard Slots for 1/10/25/100/200GE Ethernet Adapter

Expansion slots

10 PCIe Standard Slots (6 PCIe5.0 and 4 PCIe4.0) and 2 Onboard OCP 3.0 Slots; CXL1.1

Supports Full-OCP architecture and can support up to 8 OCP3.0 slots*

Ports

Standard: 1 Rear VGA Port, 3 USB 3.0 Ports (1 Front, 2 Rear), 1 USB 2.0 Internal Port, 1 RJ45 Management Port

Optional: 1 Rear Serial Port, Mounting Bracket Kit with 1 Type-C Port, 1 VGA Port, 1 USB 2.0 Port

GPU

4 Dual-Slot* or 8 Single-Slot GPU Modules

Optical drive

External Optical Disk Drive, Optional

Management

H3C HDM Standard License, iFIST (embedded), H3C Advanced Feature Package License (optional, requires licenses), H3C UniSystem (requires download)

Support LCD Touchable Intelligent Management Module

Security

Intelligent Front Security Bezel

Chassis Intrusion Detection

TPM 2.0

2FA for HDM

Intel SGX2.0

Power supplies

1+1 Redundancy Power Supply

Titanium 1600W/3200W

Platinum 800W/1300W/1600W/2000W/2700W

DC Power Supply

Hot Swappable Redundant Fans

Standards

CE, UL, FCC, VCCI, CB, etc.

Operating temperature

5°C to 45°C (41°F to 113°F)

Dimensions

(H*W*D)

2U Height

87.5*445.4*780mm (3.44*17.54*30.7 in) (Without a security bezel)

87.5*445.4*808mm (3.44*17.54*31.8 in) (With a security bezel)